Home NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo 外國關聯半導體積體電路 - Rebound Electronics Co., Ltd. [NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo]
NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo

外國關聯半導體積體電路 - Rebound Electronics Co., Ltd. [NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo]

外國關聯半導體積體電路 - Rebound Electronics Co., Ltd. [NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo]
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松香焊絲/松香焊帶 - Uchihashi Estec Co.,Ltd. [NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo]

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總部位於英國、在日本設有分公司的半導體積體電路製造商Rebound Electronics在2026年日本電子裝置展（NEPCON JAPAN 2026）上首次亮相。該公司強調其在降低製造成本方面的優勢，這得益於其位於杜拜的採購中心，該公司正在積極尋求製造方面的合作。Generated by Gemini

網站:https://reboundeu.com/

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Tags 工具機/金屬加工日本機械/工業技術汽車（包括零件/機械）測試/測量與分析/精密機械物料搬運/氣動製造技術與工程運輸/物流/包裝電氣與電子（產品/機械）
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松香焊絲/松香焊帶 - Uchihashi Estec Co.,Ltd. [NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing and Packaging Technology Expo]

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